Regenerative wafers are in the semiconductor IC manufacturing process, there are hundreds of process, in order to ensure the quality of the finished, each process needs to be monitored, then you need to use the lower cost of the test wafer to ensure that the process parameters are correct, and Guarantee the production yield of the product. Therefore, the use of process monitoring (Die wafer) and die (Dummy wafer) with the wafer, recycling and re-use, can reduce the cost of Test wafer and Dummy wafer, it is called renewable wafers. It is a misunderstanding that the bad product produced by the IC is often misunderstood.
Usually this test wafer material is cut from the poor quality of the bar on both sides of the bar, and by grinding, polishing, cleaning and other procedures, made into a test wafer. The process characteristics of the regenerated wafers include the use of Ductile Mode Grinding to replace the traditional lapping process, which reduces the processing of the metamorphic layer and reduces the contamination of the chemical and improves the machining accuracy. The most advanced reproduction of the wafer process.